A manufacturer needs a material for a computer heat sink that will rapidly carry heat…

CHEMISTRY · Single correct · A Level · Chemistry · Bonding · Bonding

Problem

A manufacturer needs a material for a computer heat sink that will rapidly carry heat away from the central processor, conduct electricity to allow grounding, and can be formed into thin fins without cracking. Which material is most suitable? (a) Graphite (b) Copper (c) Diamond (d) Aluminum

Related theory

Browse the problem library