A circuit built around a diode (Chapter 12) uses a copper connecting wire of length…

PHYSICS · Subjective · Fermi University Physics · Electricity, Magnetism & Electromagnetism · Condensed Matter, Materials & Soft Matter · Electronic transport in solids

Condensed Matter Physics, Ch Real crystals: vacancies, dislocations and the strength of metals

Problem

A circuit built around a diode (Chapter 12) uses a copper connecting wire of length L=2.0 mL = 2.0\ \mathrm{m} and cross-sectional area A=0.50 mm2A = 0.50\ \mathrm{mm^2}, carrying the diode's forward current of I=150 mAI = 150\ \mathrm{mA}. The design allows at most 15 mV15\ \mathrm{mV} of voltage drop across this wire. Recall from Chapter 8 that pure copper at 300 K300\ \mathrm{K} has resistivity ρe=1.70×10−8 Ω m\rho_e = 1.70\times10^{-8}\ \Omega\,\mathrm{m}, and recall from this chapter that one atomic per cent of dissolved nickel adds 1.2×10−8 Ω m1.2\times10^{-8}\ \Omega\,\mathrm{m} at every temperature. Find the maximum nickel content, in atomic per cent, that the wire can carry and still meet the voltage budget.

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