Intrinsic Semiconductors

In 1874 a young German physicist named Karl Ferdinand Braun found something no theory of the day could explain. He pressed a fine metal wire against a lump of lead-sulphide crystal and found current flowed easily one way through the contact but barely at all the other way — a wire and a crystal, no vacuum and no filament, behaving like a one-way valve for electricity. Braun could not say why; the electron would not be discovered for another twenty-three years. But he had stumbled onto the material that would one day carry every bit of every message on Earth: the semiconductor. The previous article sorted all solids by a single number — the width of the forbidden gap between the filled valence band and the empty conduction band. A metal has no gap; an insulator like diamond has a huge one (∼ ⁣5.5 eV\sim\!5.5\ \text{eV}); and in between sits a narrow class with a small gap — silicon at 1.1 eV1.1\ \text{eV}, germanium at 0.7 eV0.7\ \text{eV}. This article is about what happens inside a pure, perfectly clean crystal of one of those in-between materials: an intrinsic semiconductor. We will see that at absolute zero it is a flawless insulator; that room-temperature heat is just enough to snap a few bonds and set electrons loose; that every freed electron leaves behind a mobile hole carrying positive charge; that in a pure crystal these come in exactly equal numbers, ne=nh=nin_e = n_h = n_i; and — the fact that startles every student — that heating a semiconductor makes it conduct better, the exact opposite of a metal. All of it with school algebra and the band picture you already own.

Key takeaways
  • An intrinsic semiconductor is a pure crystal of a small-gap material — silicon (Eg=1.1 eVE_g = 1.1\ \text{eV}) or germanium (Eg=0.7 eVE_g = 0.7\ \text{eV}) — with no added impurities. Each atom shares four covalent bonds with its neighbours.
  • At absolute zero it is a perfect insulator. Every valence electron is locked in a bond; the conduction band is empty and no charge can move.
  • Room-temperature heat breaks a few bonds. Thermal energy kT≈0.026 eVkT \approx 0.026\ \text{eV} occasionally lifts an electron across the gap, creating a free electron in the conduction band and a hole in the valence band — an electron–hole pair.
  • A hole is a mobile positive carrier, not a passive gap. A neighbouring bond electron hops into it, so the vacancy drifts the other way; under a field, electrons and holes move oppositely but push current the same way.
  • In a pure crystal the two carriers are born in pairs, so their numbers are equal: ne=nh=nin_e = n_h = n_i, the intrinsic carrier concentration (ni≈1.5×1016 m−3n_i \approx 1.5\times10^{16}\ \text{m}^{-3} for Si, 2.4×1019 m−32.4\times10^{19}\ \text{m}^{-3} for Ge at 300 K300\ \text{K}).
  • Heating a semiconductor makes it conduct better — more pairs form — the reverse of a metal, whose resistance rises with temperature. This negative temperature coefficient is a semiconductor's signature.
  • Key idea: in a pure semiconductor thermal energy breaks covalent bonds to create equal numbers of free electrons and mobile holes, n_e = n_h = n_i, and because more pairs form as the crystal is heated, its conductivity rises with temperature — opposite to a metal.
The core insight

A pure silicon or germanium crystal is an insulator at absolute zero, but thermal energy of order kT≈0.026 eVkT \approx 0.026\ \text{eV} breaks a tiny fraction of its covalent bonds, each broken bond freeing one conduction electron and leaving one mobile positive hole, so that the two carriers occur in exactly equal numbers ne=nh=nin_e = n_h = n_i; because the number of pairs grows steeply with temperature, the conductivity of a semiconductor increases when it is heated — the defining contrast with a metal.

Where this lives today

Every silicon chip on Earth begins as intrinsic material. Raw silicon is refined to better than one foreign atom in a billion — "nine-nines" electronic-grade silicon — and grown into single crystals the width of a dinner plate, because only a near-perfect intrinsic starting crystal lets engineers add impurities exactly where they want them. That near-empty canvas is then patterned into the billions of transistors on a modern processor. The steep temperature dependence you met here is used directly in the thermistor, a semiconductor whose resistance drops predictably as it warms — the sensor behind digital thermometers and battery-management systems. The absorption edge set by the gap is why silicon photodiodes and solar cells respond to visible light while germanium reaches into the infrared for fibre-optic receivers. And the equal-carrier balance that defines intrinsic material is the reference point from which the next article departs: dope the crystal, tilt the balance toward electrons or holes, and you have the raw ingredient of the p–n junction, the diode, and the transistor — the whole of modern electronics.

The physical picture

Take a single atom of silicon. It has four electrons in its outermost shell — it sits in group IV of the periodic table, like germanium below it and carbon (diamond) above it. In a crystal each silicon atom shares one of those four electrons with each of its four nearest neighbours, forming four covalent bonds. Every valence electron is thereby spoken for, glued into a shared bond. This is the same picture as the filled valence band of the previous article — "valence band full" and "every bond occupied" say the same thing. At absolute zero this crystal carries no current at all. Not one electron is free to wander; the conduction band above the 1.1 eV1.1\ \text{eV} gap is completely empty. A perfect intrinsic crystal at T=0T = 0 is a perfect insulator, indistinguishable electrically from diamond — the only difference is the size of the gap it would take to liberate an electron. Now warm the crystal to room temperature. Its atoms jiggle with thermal energy, and the typical thermal quantum is kT≈0.026 eVkT \approx 0.026\ \text{eV} at 300 K300\ \text{K}. That is forty times smaller than silicon's 1.1 eV1.1\ \text{eV} gap, so almost every bond survives — but "almost" is the crucial word. In the lottery of 102810^{28} jiggling atoms, a rare few bonds absorb enough of a thermal fluctuation to break, and the freed electron is kicked across the gap into the conduction band, where it roams the whole crystal. That is thermal generation of an electron–hole pair.

Figure
A silicon covalent lattice shown cold on the left with every bond intact and no free charge, and warm on the right where thermal energy has broken one bond, releasing a free electron into the crystal and leaving a positive hole that neighbouring bond electrons hop into so it drifts the opposite way
A pure silicon crystal — cold it insulates, warm it makes electron–hole pairs T = 0 K · every bond intact · insulator Si 4 shared bonds per atom · valence band full T = 300 K · one bond broken · a pair ✕ − free e⁻ + hole free electron roams · hole drifts as bond electrons hop in one broken bond = one free electron + one hole → n_e = n_h

The electron is only half the story. The bond it left behind now misses an electron — a little pocket of net positive charge. This vacancy is called a hole, and it is the concept that trips up most beginners. The hole does not sit still: an electron in a neighbouring intact bond can slip sideways into the vacancy, which costs almost nothing since it is a hop between bonds, not a jump across the gap. Now the bond it came from is the one missing an electron — the vacancy has moved. Repeat this and the hole shuffles through the crystal like a bubble rising through water, or the empty seat that travels down a row as each person shifts over. A hole is genuinely mobile, and being a region of missing negative charge, it behaves in every measurable way as a positive charge carrier of magnitude +e+e. So a pure semiconductor conducts by two carriers at once. Apply a field and the free electrons drift one way, the holes the other; because their charges are opposite, both push current in the same direction. This two-carrier conduction — electrons in the conduction band, holes in the valence band — is the whole secret of the semiconductor, and why it is far more versatile than a metal, which conducts by electrons alone.

Counting the carriers: why n_e equals n_h equals n_i

Here is the most important consequence of demanding a pure crystal. Every conduction electron got there by breaking a bond, and breaking a bond makes exactly one hole. There is no other source of either carrier — no impurity atoms donating spare electrons or grabbing them. Electrons and holes are therefore created strictly in pairs and destroyed in pairs (when a wandering electron falls back into a hole, both vanish — that is recombination). At any temperature the crystal settles into a balance where generation and recombination run at equal rates, and in that steady state the carrier counts are equal:

ne=nh=ni.(1)n_e = n_h = n_i. \qquad (1)

where: nen_e is the free-electron concentration, nhn_h the hole concentration, and nin_i their common value, the intrinsic carrier concentration. The physical reading is bookkeeping made rigorous: you cannot make a free electron in a pure crystal without simultaneously making a hole, so you always have exactly as many of one as the other. It is also charge neutrality — the crystal is uncharged, the negative electrons exactly balanced by the positive holes. The value of nin_i depends only on material and temperature. At 300 K300\ \text{K} the measured figures are ni≈1.5×1016 m−3n_i \approx 1.5\times10^{16}\ \text{m}^{-3} for silicon and 2.4×1019 m−32.4\times10^{19}\ \text{m}^{-3} for germanium — germanium has about sixteen hundred times more carriers, purely because its smaller gap (0.70.7 vs 1.1 eV1.1\ \text{eV}) breaks bonds more readily. Diamond's 5.5 eV5.5\ \text{eV} gap gives an nin_i so vanishingly small that it is an insulator at any temperature you can survive. These numbers sound large until you compare them with the number of atoms: a cubic metre of silicon holds about 5×10285\times10^{28}. Dividing, only about one atom in 3×10123\times10^{12} has given up an electron at room temperature. A pure semiconductor is a spectacularly poor conductor — but that scarcity is not a defect, it is the blank canvas. Because pure silicon has so few carriers of its own, adding a trace of impurity (the doping of the next article) can multiply the carrier count a millionfold and put the conductivity entirely under our control.

Why conduction climbs with temperature

Now to the fact that feels wrong the first time you meet it. Cool a copper wire and it conducts better; cool a silicon crystal and it conducts worse, until near absolute zero it stops altogether. Semiconductors have a negative temperature coefficient of resistance — resistance falls as temperature rises — the cleanest fingerprint distinguishing a semiconductor from a metal. The reason is already in the physical picture. In a metal the carriers are always there; heating cannot add electrons, it only makes the lattice vibrate more and jostle them, so resistance rises. In a semiconductor the carriers must first be created by breaking bonds, and heat is exactly what breaks bonds. Raise the temperature and you make more electron–hole pairs, flooding the crystal with carriers. This carrier-multiplication swamps the modest rise in scattering, so conductivity climbs — steeply — with temperature. How steeply? The number of pairs follows a law borrowed from statistical physics, which we quote rather than derive (the full result comes from Fermi–Dirac statistics and a density-of-states integral over the bands — both beyond this article's algebra, so we take the formula on trust and check that it reproduces the measured nin_i):

ni=A T3/2 exp⁡ ⁣(−Eg2kT).(2)n_i = A\,T^{3/2}\,\exp\!\left(-\frac{E_g}{2kT}\right). \qquad (2)

where: TT is the absolute temperature, EgE_g the band gap, k=8.617×10−5 eV K−1k = 8.617\times10^{-5}\ \text{eV K}^{-1} Boltzmann's constant, and AA a material constant. The exponential factor dominates everything: Eg/2kTE_g/2kT for silicon at 300 K300\ \text{K} is about 2121, so exp⁡(−21)≈6×10−10\exp(-21) \approx 6\times10^{-10}, only a minuscule fraction of bonds broken at any instant. But because the gap sits divided by temperature inside an exponential, a small rise in TT shrinks the exponent and multiplies nin_i dramatically — warming silicon from 300300 to 400 K400\ \text{K} multiplies its carrier concentration roughly three-hundred-fold. The smaller the gap, the milder the exponent and the more carriers, which is exactly why germanium out-carries silicon.

Figure
An energy-band diagram of an intrinsic semiconductor showing a full valence band and empty conduction band separated by a small forbidden gap E_g, with thermal energy lifting a few electrons across the gap at 300 K to leave an equal number of holes below, contrasted at left with a metal whose bands overlap and at right with an insulator whose gap is far too wide
The band picture — the gap sorts metal, semiconductor, insulator metal bands overlap carriers always free E_g ≈ 0 semiconductor conduction band valence band E_g ≈ 1.1 eV heat lifts a few e⁻ across → equal holes n_e = n_h = n_i insulator conduction band valence band E_g ≈ 5.5 eV gap too wide to cross kT ≈ 0.026 eV at 300 K ≪ 1.1 eV — only a rare bond breaks heat the semiconductor → more pairs → conductivity rises (opposite to a metal)

The conductivity of a pure semiconductor

We can now write down how well an intrinsic crystal conducts. Under a field EE each carrier drifts at a speed proportional to the field, the constant of proportionality being its mobility μ\mu. Both carriers contribute, so conductivity is the sum of an electron and a hole term; for the intrinsic case ne=nh=nin_e = n_h = n_i it collapses to a single clean expression:

σ=ni e (μe+μh).(3)\sigma = n_i\,e\,(\mu_e + \mu_h). \qquad (3)

where: σ\sigma is the conductivity (siemens per metre), e=1.6×10−19 Ce = 1.6\times10^{-19}\ \text{C}, μe\mu_e and μh\mu_h are the electron and hole mobilities, and nin_i the intrinsic concentration. Conductivity is carrier density times charge times mobility, summed over both carrier types. Electrons are always the more mobile (they roam a real band, while holes advance by the slower relay of bond-hopping), so μe>μh\mu_e > \mu_h in every semiconductor — for silicon μe≈0.135\mu_e \approx 0.135 and μh≈0.048 m2V−1s−1\mu_h \approx 0.048\ \text{m}^2\text{V}^{-1}\text{s}^{-1}. The derivation below turns these into a resistivity of about 2.3×103 Ω m2.3\times10^{3}\ \Omega\,\text{m} for pure silicon — vastly more resistive than copper's 1.7×10−8 Ω m1.7\times10^{-8}\ \Omega\,\text{m}, yet vastly less than a true insulator. A photon can do the same job as heat: if its energy hνh\nu exceeds the gap it can break a bond and make a pair. The longest wavelength that still carries enough energy sets an absorption edge:

λmax⁡=hcEg,(4)\lambda_{\max} = \frac{hc}{E_g}, \qquad (4)

which for silicon (Eg=1.1 eVE_g = 1.1\ \text{eV}, hc=1240 eV nmhc = 1240\ \text{eV nm}) gives λmax⁡=1240/1.1≈1127 nm\lambda_{\max} = 1240/1.1 \approx 1127\ \text{nm}, in the near-infrared. Shorter wavelengths — all the visible spectrum — are absorbed, which is why a silicon wafer looks opaque grey; longer wavelengths pass through, which is why silicon is a favourite infrared window and detector. Germanium's smaller gap pushes its edge out to 1240/0.7≈1771 nm1240/0.7 \approx 1771\ \text{nm}.

Derivation AIntrinsic conductivity of silicon from carrier drift

The goal is to build the conductivity formula σ=nie(μe+μh)\sigma = n_i e(\mu_e+\mu_h) from the definition of drift and mobility, then put in silicon's room-temperature numbers to find its intrinsic conductivity and resistivity — showing a pure semiconductor sits, numerically, many powers of ten from both a metal and a true insulator. No calculus is needed: current density is charge density times drift velocity, and mobility is drift velocity per unit field.

Step 1. Start from what a current is. If a carrier species has number density nn, charge magnitude ee, and drifts at speed vdv_d under a field, the current density it carries is J=n e vdJ = n\,e\,v_d — count the carriers crossing unit area per second and multiply by their charge.

Step 2. Define mobility by vd=μEv_d = \mu E: the drift speed is proportional to the field, and μ\mu is that proportionality. Substituting, one carrier species gives J=neμEJ = n e \mu E. Comparing with the microscopic Ohm's law J=σEJ = \sigma E identifies its contribution to conductivity as σ=neμ\sigma = n e \mu.

Step 3. A semiconductor has two carrier species drifting in opposite directions but adding to the current in the same sense, so their conductivities add: σ=neeμe+nheμh\sigma = n_e e \mu_e + n_h e \mu_h. In an intrinsic crystal ne=nh=nin_e = n_h = n_i, which factors to σ=nie(μe+μh)\sigma = n_i e (\mu_e + \mu_h) — equation (3).

Step 4. Insert silicon at 300 K300\ \text{K}: ni=1.5×1016 m−3n_i = 1.5\times10^{16}\ \text{m}^{-3}, e=1.6×10−19 Ce = 1.6\times10^{-19}\ \text{C}, μe+μh=0.135+0.048=0.183 m2V−1s−1\mu_e + \mu_h = 0.135 + 0.048 = 0.183\ \text{m}^2\text{V}^{-1}\text{s}^{-1}. Then σ=(1.5×1016)(1.6×10−19)(0.183)≈4.4×10−4 S m−1\sigma = (1.5\times10^{16})(1.6\times10^{-19})(0.183) \approx 4.4\times10^{-4}\ \text{S m}^{-1} and ρ=1/σ≈2.3×103 Ω m\rho = 1/\sigma \approx 2.3\times10^{3}\ \Omega\,\text{m}. Germanium (ni=2.4×1019n_i = 2.4\times10^{19}, μe=0.39\mu_e = 0.39, μh=0.19\mu_h = 0.19) gives σ≈2.2 S m−1\sigma \approx 2.2\ \text{S m}^{-1}, ρ≈0.45 Ω m\rho \approx 0.45\ \Omega\,\text{m} — about five thousand times better than silicon, tracking its larger nin_i. Verified: μe+μh=0.183\mu_e+\mu_h = 0.183, σSi=4.4×10−4 S m−1\sigma_{\text{Si}} = 4.4\times10^{-4}\ \text{S m}^{-1}, ρSi=2.3×103 Ω m\rho_{\text{Si}} = 2.3\times10^{3}\ \Omega\,\text{m}, σGe=2.2 S m−1\sigma_{\text{Ge}} = 2.2\ \text{S m}^{-1}, ρGe=0.45 Ω m\rho_{\text{Ge}} = 0.45\ \Omega\,\text{m} — recomputed in verify_hs2-intrinsic-semiconductors.py.

Go deeper · Derivation B · 1 minHow steeply the carrier count climbs with temperature
Derivation BHow steeply the carrier count climbs with temperature

The goal is to make the negative temperature coefficient quantitative: to show, from the quoted law ni=A T3/2exp⁡(−Eg/2kT)n_i = A\,T^{3/2}\exp(-E_g/2kT), that heating pure silicon by only a hundred kelvin multiplies its intrinsic carrier concentration by a large factor — the mechanism behind a semiconductor conducting better when warmed. We take a ratio between two temperatures so the unknown material constant AA cancels cleanly; only algebra and the exponential function are used.

Step 1. Write the law at two temperatures T1=300 KT_1 = 300\ \text{K} and T2=400 KT_2 = 400\ \text{K} and divide. The constant AA cancels: ni(T2)ni(T1)=(T2T1)3/2exp⁡ ⁣[−Eg2k(1T2−1T1)]\dfrac{n_i(T_2)}{n_i(T_1)} = \left(\dfrac{T_2}{T_1}\right)^{3/2}\exp\!\left[-\dfrac{E_g}{2k}\left(\dfrac{1}{T_2}-\dfrac{1}{T_1}\right)\right].

Step 2. Evaluate the exponent. With Eg=1.1 eVE_g = 1.1\ \text{eV} and k=8.617×10−5 eV K−1k = 8.617\times10^{-5}\ \text{eV K}^{-1}, the group Eg/2k=1.1/(2×8.617×10−5)=6.38×103 KE_g/2k = 1.1/(2\times8.617\times10^{-5}) = 6.38\times10^{3}\ \text{K}. The bracket is (1300−1400)=8.33×10−4 K−1\left(\tfrac{1}{300}-\tfrac{1}{400}\right) = 8.33\times10^{-4}\ \text{K}^{-1}, so the exponent gain is 6.38×103×8.33×10−4=5.326.38\times10^{3}\times 8.33\times10^{-4} = 5.32, giving a factor exp⁡(5.32)≈204\exp(5.32) \approx 204.

Step 3. The slowly-varying prefactor contributes (400/300)3/2=(1.333)1.5=1.54(400/300)^{3/2} = (1.333)^{1.5} = 1.54. Multiplying, ni(400)ni(300)=1.54×204≈314\dfrac{n_i(400)}{n_i(300)} = 1.54 \times 204 \approx 314.

Step 4. So a mere 100 K100\ \text{K} rise multiplies the intrinsic carrier count — and roughly the conductivity — by about three hundred. Notice which factor did the work: the T3/2T^{3/2} term changed things by only 54%54\%, while the exponential drove the 200200-fold jump. This is why a semiconductor's resistance plummets on heating, and why it must be temperature-stabilised in precise circuits: the carriers are conjured by heat. Verified: Eg/2k=6.38×103 KE_g/2k = 6.38\times10^{3}\ \text{K}, exponent gain 5.325.32, exp⁡(5.32)=204\exp(5.32) = 204, prefactor 1.541.54, ratio ≈314\approx 314 — recomputed in verify_hs2-intrinsic-semiconductors.py.

Limiting cases

caseresultmeaning
T→0 KT \to 0\ \text{K}ni→0n_i \to 0, σ→0\sigma \to 0perfect insulator — every bond intact, conduction band empty
TT increasesnin_i rises steeply (exponentially)more pairs — conductivity rises, the semiconductor signature
smaller gap EgE_glarger nin_i at fixed TTGe (0.7 eV0.7\ \text{eV}) out-carries Si (1.1 eV1.1\ \text{eV}) by ∼ ⁣1600×\sim\!1600\times
very large gap (∼ ⁣5.5 eV\sim\!5.5\ \text{eV})nin_i negligible at any usable TTdiamond — an insulator, not a semiconductor
pure crystal (no dopant)ne=nh=nin_e = n_h = n_i exactlythe intrinsic condition; carriers born only in pairs
μe\mu_e vs μh\mu_hμe>μh\mu_e > \mu_h alwayselectrons roam a band; holes advance by slower bond-hopping

Worked examples

Board level — the absorption edge of silicon and germanium (CBSE and ICSE pattern)

A photon can create an electron–hole pair only if its energy is at least the band gap. Using hc=1240 eV nmhc = 1240\ \text{eV nm}, find the longest wavelength of light that a pure silicon crystal (Eg=1.1 eVE_g = 1.1\ \text{eV}) can absorb by this mechanism, and repeat for germanium (Eg=0.7 eVE_g = 0.7\ \text{eV}). Which of the two can detect ordinary visible light, and which reaches further into the infrared?

Step 1. The threshold condition is hν=hc/λ≥Egh\nu = hc/\lambda \ge E_g, so the longest usable wavelength is λmax⁡=hc/Eg\lambda_{\max} = hc/E_g.

Step 2. For silicon: λmax⁡=1240/1.1=1127 nm\lambda_{\max} = 1240/1.1 = \boxed{1127\ \text{nm}}, in the near-infrared. Any wavelength shorter than this — all visible light, 400400–700 nm700\ \text{nm} — carries more than 1.1 eV1.1\ \text{eV} and is absorbed, which is why silicon photodetectors and solar cells work across the whole visible band.

Step 3. For germanium: λmax⁡=1240/0.7=1771 nm\lambda_{\max} = 1240/0.7 = \boxed{1771\ \text{nm}}. Its smaller gap lets it respond to longer infrared wavelengths that silicon cannot see — which is exactly why germanium and other narrow-gap semiconductors are chosen for infrared sensing.

Step 4. Both absorb visible light (visible photons exceed both gaps), but germanium reaches further into the infrared. The rule to carry away: a smaller gap means a longer cut-off wavelength, since a less energetic, longer-wavelength photon suffices to bridge it.

Competitive level — intrinsic conductivity and resistivity of germanium (JEE and NEET pattern)

Pure germanium at 300 K300\ \text{K} has ni=2.4×1019 m−3n_i = 2.4\times10^{19}\ \text{m}^{-3}, electron mobility μe=0.39 m2V−1s−1\mu_e = 0.39\ \text{m}^2\text{V}^{-1}\text{s}^{-1} and hole mobility μh=0.19 m2V−1s−1\mu_h = 0.19\ \text{m}^2\text{V}^{-1}\text{s}^{-1}. Take e=1.6×10−19 Ce = 1.6\times10^{-19}\ \text{C}. Find its conductivity and resistivity, and compare with pure silicon's resistivity of about 2.3×103 Ω m2.3\times10^{3}\ \Omega\,\text{m}.

Step 1. Both carriers contribute, and for an intrinsic crystal ne=nh=nin_e = n_h = n_i, so σ=nie(μe+μh)\sigma = n_i e(\mu_e + \mu_h). Add the mobilities first: μe+μh=0.39+0.19=0.58 m2V−1s−1\mu_e + \mu_h = 0.39 + 0.19 = 0.58\ \text{m}^2\text{V}^{-1}\text{s}^{-1}.

Step 2. Substitute: σ=(2.4×1019)(1.6×10−19)(0.58)\sigma = (2.4\times10^{19})(1.6\times10^{-19})(0.58). Group the powers of ten: (2.4)(1.6)=3.84(2.4)(1.6) = 3.84 and 1019×10−19=110^{19}\times10^{-19} = 1, so σ=3.84×0.58=2.2 S m−1\sigma = 3.84 \times 0.58 = \boxed{2.2\ \text{S m}^{-1}}.

Step 3. Resistivity is the reciprocal: ρ=1/σ=1/2.23=0.45 Ω m\rho = 1/\sigma = 1/2.23 = \boxed{0.45\ \Omega\,\text{m}}.

Step 4. Compare germanium's 0.45 Ω m0.45\ \Omega\,\text{m} against silicon's 2.3×103 Ω m2.3\times10^{3}\ \Omega\,\text{m} — germanium conducts roughly five thousand times better, a direct consequence of its 1600×1600\times larger carrier density. The gap is doing the work: germanium's narrower 0.7 eV0.7\ \text{eV} gap breaks far more bonds at 300 K300\ \text{K}. Timing note: about ninety seconds — one substitution into σ=nie(μe+μh)\sigma = n_i e(\mu_e+\mu_h) and one reciprocal. The exam-saving trick is to add the mobilities first and pair each 101910^{19} with a 10−1910^{-19} so the powers of ten annihilate, leaving the single multiplication 3.84×0.583.84\times0.58 to do in your head.

Competitive level — how many times more carriers on heating (JEE Advanced pattern)

Using ni=A T3/2exp⁡(−Eg/2kT)n_i = A\,T^{3/2}\exp(-E_g/2kT) for silicon (Eg=1.1 eVE_g = 1.1\ \text{eV}, k=8.617×10−5 eV K−1k = 8.617\times10^{-5}\ \text{eV K}^{-1}), estimate the factor by which the intrinsic carrier concentration increases when the crystal is heated from 300 K300\ \text{K} to 400 K400\ \text{K}.

Step 1. Take the ratio at the two temperatures so the unknown constant AA cancels: ni(400)ni(300)=(400300)3/2exp⁡ ⁣[−Eg2k(1400−1300)]\dfrac{n_i(400)}{n_i(300)} = \left(\dfrac{400}{300}\right)^{3/2}\exp\!\left[-\dfrac{E_g}{2k}\left(\dfrac{1}{400}-\dfrac{1}{300}\right)\right].

Step 2. The exponential group: Eg/2k=1.1/(2×8.617×10−5)=6.38×103 KE_g/2k = 1.1/(2\times8.617\times10^{-5}) = 6.38\times10^{3}\ \text{K}, and (1300−1400)=8.33×10−4 K−1\left(\tfrac{1}{300}-\tfrac{1}{400}\right) = 8.33\times10^{-4}\ \text{K}^{-1}, so the exponent is +5.32+5.32 and exp⁡(5.32)=204\exp(5.32) = \boxed{204}.

Step 3. The prefactor: (400/300)3/2=(1.333)1.5=1.54(400/300)^{3/2} = (1.333)^{1.5} = 1.54.

Step 4. Multiply: ni(400)ni(300)=1.54×204≈314\dfrac{n_i(400)}{n_i(300)} = 1.54\times204 \approx \boxed{314}. A 100 K100\ \text{K} warming multiplies the carriers — and roughly the conductivity — by about three hundred, almost all from the exponential. That sensitivity is why a bare intrinsic semiconductor makes a superb thermistor but a treacherous circuit element unless temperature-controlled. Timing note: two minutes, and it lives or dies on the exponent. Compute Eg/2k=6.4×103 KE_g/2k = 6.4\times10^{3}\ \text{K} once, note the bracket 1/300−1/400=100/120000=8.3×10−41/300-1/400 = 100/120000 = 8.3\times10^{-4}, and the rest is one exp⁡\exp and one 1.51.5-power. Do not evaluate AA or the absolute nin_i — the ratio was engineered to make them vanish.

Exam traps

Saying resistance rises with temperature. This is metal reasoning misapplied. A semiconductor's resistance falls as it is heated, because heat manufactures new electron–hole pairs. Writing "the atoms vibrate more so the semiconductor conducts less" is the most common way to throw away marks here in CBSE, NEET and JEE alike.

Treating a hole as mere empty space that cannot carry current. A hole is a genuinely mobile positive carrier: bond electrons hop into the vacancy, so it drifts and carries real current, at roughly half the mobility of a free electron. In intrinsic material electrons and holes carry the current together, in equal numbers.

Forgetting that ne=nhn_e = n_h holds only for the pure crystal. The instant you dope it — next article — the equality breaks: one carrier becomes majority, the other minority, though the product nenh=ni2n_e n_h = n_i^2 stays fixed. Quoting ne=nhn_e = n_h for a doped sample is a classic slip.

Confusing kTkT with EgE_g. The thermal quantum kT≈0.026 eVkT \approx 0.026\ \text{eV} at 300 K300\ \text{K} is about forty times smaller than silicon's 1.1 eV1.1\ \text{eV} gap. Room heat crosses the gap only in the rare tail of the thermal distribution, which is why nin_i is so tiny — do not write "kTkT excites electrons across the gap" as though it were easy.

Getting the gap–carrier direction backwards. A smaller gap gives more carriers and a longer absorption edge, because less energy breaks a bond. Germanium (0.7 eV0.7\ \text{eV}) beats silicon (1.1 eV1.1\ \text{eV}) on both. Students routinely reverse this.

Board scope. The quantitative intrinsic-carrier physics — nin_i, the mobilities, σ=nie(μe+μh)\sigma = n_i e(\mu_e+\mu_h) and the temperature law — is core on CBSE, ICSE (ISC), JEE Main, JEE Advanced and NEET; the qualitative electron–hole and band picture gives useful background to the semiconductor-device topics of Cambridge A-Level, but its syllabus does not itself examine intrinsic-carrier concentration or the conductivity formula, so treat those numbers as enrichment for an A-Level answer. AP Physics 2 does not carry semiconductor electronics at all, and current IB Physics has moved electronics out of the core — do not assume this material is on either. IGCSE 0625 meets diodes and logic gates only qualitatively and does not require the intrinsic-carrier or conductivity numbers; give an IGCSE-style answer, if asked, in words rather than in mobilities and exponentials.

Origins · 1 minKarl Ferdinand Braun and how this was discovered
KF
Karl Ferdinand Braun
1850–1918 · Fulda and Strasbourg, Germany

Karl Ferdinand Braun was the German physicist who first tamed the semiconductor without knowing what it was. In 1874, studying current through metal-sulphide crystals such as galena, he found that many point contacts conduct far more readily in one direction than the other — the first clear observation of semiconductor rectification, decades before electrons, bands or holes were understood. That effect became the "cat's-whisker" crystal detector at the heart of early radio. Braun went on to invent the cathode-ray tube in 1897 — the "Braun tube," ancestor of every oscilloscope and television screen — and to develop the tuned, coupled circuits that made long-range wireless practical, for which he shared the 1909 Nobel Prize in Physics with Guglielmo Marconi. Stranded in the United States during the First World War, he died in Brooklyn in 1918. The one-way crystal conduction he found is precisely the asymmetric behaviour this whole chapter goes on to explain.

History
1833
— Michael Faraday finds that silver sulphide conducts better when heated, the opposite of a metal — the first recorded hint of semiconductor behaviour.
1874
— Karl Ferdinand Braun discovers one-way (rectifying) conduction in metal-sulphide crystals, the effect behind the crystal-radio detector.
1879
— Edwin Hall's effect later gives physicists a way to measure the sign and density of the carriers, eventually confirming that holes act as positive charges.
1928
— Felix Bloch's band theory shows that a crystal's electrons occupy allowed energy bands separated by forbidden gaps.
1931
— Alan Wilson builds the quantum theory of intrinsic semiconductors, explaining thermal electron–hole pairs and conduction by holes.
1947
— Bardeen and Brattain build the first (point-contact) transistor at Bell Labs; Shockley follows with the junction transistor in 1948. The three share the 1956 Nobel Prize, and the electronic age begins.

Going further

Texts. NCERT Physics Class 12, Chapter 14 ("Semiconductor Electronics"), the intrinsic-semiconductor sections · H. C. Verma, Concepts of Physics Vol. 2, "Semiconductors and Semiconductor Devices" · Halliday, Resnick & Walker, Fundamentals of Physics, "Conduction of Electricity in Solids" · Kittel, Introduction to Solid State Physics, for the carrier-statistics treatment behind equation (2).

Provenance. LANE_SPEC anchor values and standard textbook mobilities. Recompute: kT=8.617×10−5×300=0.0259≈0.026 eVkT = 8.617\times10^{-5}\times300 = 0.0259 \approx 0.026\ \text{eV}; Eg/kT(Si)=42.6E_g/kT(\text{Si}) = 42.6; exp⁡(−Eg/2kT)=exp⁡(−21.3)=5.8×10−10\exp(-E_g/2kT) = \exp(-21.3) = 5.8\times10^{-10}; nin_i: Si 1.5×10161.5\times10^{16}, Ge 2.4×1019 m−32.4\times10^{19}\ \text{m}^{-3}, ratio 16001600; Si atom density 5.0×10285.0\times10^{28}, atoms per electron 3.3×10123.3\times10^{12}; edges λmax⁡=1240/Eg\lambda_{\max} = 1240/E_g give 11271127 and 1771 nm1771\ \text{nm}; σ=nie(μe+μh)\sigma = n_i e(\mu_e+\mu_h) gives Si 4.4×10−4 S m−14.4\times10^{-4}\ \text{S m}^{-1} (ρ=2.3×103 Ω m\rho = 2.3\times10^{3}\ \Omega\,\text{m}) and Ge 2.2 S m−12.2\ \text{S m}^{-1} (ρ=0.45 Ω m\rho = 0.45\ \Omega\,\text{m}); temperature ratio (400/300)1.5exp⁡[(Eg/2k)(1/300−1/400)]=1.54×204=314(400/300)^{1.5}\exp[(E_g/2k)(1/300-1/400)] = 1.54\times204 = 314.

Prerequisites. Energy Bands in Solids — the article that established the valence band, the conduction band and the forbidden gap, and showed how the gap's width sorts conductor from semiconductor from insulator. Everything here rests on that gap being small (Si 1.1 eV1.1\ \text{eV}, Ge 0.7 eV0.7\ \text{eV}). Leads to. Extrinsic Semiconductors and Doping, which breaks the ne=nhn_e = n_h symmetry on purpose to make n-type and p-type material, and the mass-action law nenh=ni2n_e n_h = n_i^2. For the statistics behind equation (2) — where the T3/2T^{3/2} prefactor and the mid-gap Fermi level come from — the university seam on the chemical potential of a Fermi gas at finite temperature treats it properly (go-deeper only, never an exam dependency here).

What exactly is a hole, and does it really move or is that just a figure of speech?

It really moves — the "figure of speech" framing is what trips students up. When a bond loses its electron it is left with a vacancy and a net positive charge. An electron in a neighbouring bond can slip into that vacancy at almost no cost, since it only hops sideways, not across the gap — and now the bond it left is the vacant one, so the hole has moved. Chain this and the hole travels through the crystal, responding to a field exactly as a real particle of charge +e+e would. So while a hole is "made of" the collective motion of many valence electrons, treating it as a single mobile positive carrier is not a convenience but a correct, measurable description, confirmed by the sign of the Hall voltage.

Why does a semiconductor conduct better when heated, when everything else seems to conduct worse?

Because in a semiconductor the carriers have to be created, and heat creates them. In a metal the conduction electrons are always present — heating only shakes the lattice harder, scattering them more and raising resistance. A pure semiconductor at low temperature has almost no carriers; warming it breaks more bonds, each adding a free electron and a hole, and this flood overwhelms the extra scattering, so conductivity climbs steeply. The rule: metal carriers are given and heat hinders them; semiconductor carriers are made and heat makes them.

If pure silicon is such a poor conductor, why is it the most important material in electronics?

Precisely because it is such a poor conductor on its own. A pure crystal has only about one carrier per 101210^{12} atoms, so its own conductivity is almost a blank slate. That emptiness is the opportunity: adding a controlled trace of a foreign element — perhaps one atom in a million — multiplies the carrier count a millionfold and lets engineers decide, region by region, whether a patch is rich in electrons or holes. If pure silicon were already a decent conductor, its own carriers would swamp any impurity and there would be nothing to control. The next article, on doping, is entirely about exploiting this clean starting point.

Why silicon and germanium specifically, and not some other element?

Both sit in group IV, so each atom has four valence electrons and forms four covalent bonds — the tetrahedral structure that gives a well-defined gap of the right modest size. Carbon (diamond) is group IV too, but its 5.5 eV5.5\ \text{eV} gap is far too wide to break thermally, so diamond is an insulator; tin's gap is so small it behaves almost like a metal. Silicon (1.1 eV1.1\ \text{eV}) and germanium (0.7 eV0.7\ \text{eV}) land in the useful middle. Germanium came first historically (easier to purify), but silicon dominates today: it is abundant (sand is silicon dioxide), tolerates higher temperatures thanks to its larger gap, and grows a superb insulating oxide that makes chip fabrication possible.

Is the equality n_e equals n_h true for every semiconductor?

No — it is the defining property of an intrinsic (pure) semiconductor and nothing more. It holds because in a pure crystal there is no way to make one carrier without making the other: every conduction electron leaves exactly one hole. The moment you dope the crystal, the symmetry breaks — a donor adds electrons without holes, so electrons become the majority carrier and holes the minority (or vice versa). What survives doping is not ne=nhn_e = n_h but the weaker relation ne nh=ni2n_e\,n_h = n_i^2, the mass-action law of the next article. So ne=nh=nin_e = n_h = n_i holds only for the undoped crystal.

Why does the exponent contain E_g divided by 2kT, and not simply E_g over kT?

The factor of two comes from statistics we quote rather than derive. Creating a pair costs the full gap EgE_g, but the occupation of states is governed by where the Fermi level sits, and in an intrinsic crystal that level lies almost exactly in the middle of the gap. An electron must therefore be lifted only about half the gap above the Fermi level to reach the conduction band — and a hole half the gap below — which is where the Eg/2E_g/2 in the exponent comes from. The full account needs Fermi–Dirac statistics and a density-of-states integral over the bands, both beyond this article, so we take equation (2) as a quoted result and verify that it reproduces the measured nin_i.

Before this

Where this leads